Papers

• Ionization cloud formation in rotary cathode plasma confinement

• Exploration into Sputtered ITO Film Properties as a Function of Magnetic Field Strength

• Practical limitations for the bi-polar pulse sputtering of Al2O3 with rotary magnetron targets using a reactive voltage controller

• Rotary Cathode Sputtering Target Design Consideration

• Rotary Cathodes Basics – Sputtering Target Materials and Process

• Uniformity Optimization for Static Substrates Using the Swing DUO™ Software

Patents

• Laser induced ionization of inert and reactive gasses for sputtering

  • US20240263297A1 · Filed Feb 8, 2023

• Systems and methods for casting sputtering targets

  • US12134125B2 · Issued Nov 5, 2024

• Thermally controlled magnetic fields optimization system for sputter deposition processes

  • US11908669B2 · Issued Feb 20, 2024

• Systems and methods for additive manufacturing for the deposition of metal and ceramic materials

  • US11603589B2 · Issued Mar 14, 2023

• Magnetic force release for sputtering sources with magnetic target materials

  • US10727034B2 · Issued Aug 28, 2020

• Plasma enhanced chemical vapor deposition (PECVD) source

  • US9406487B2 · Issued Aug 2, 2016

• Ion control for a plasma source

  • US 9,198,274 · Issued Nov 24, 2015

• Rotatable magnetron sputtering with axially movable target electrode tube

  • US 8,535,490 · Issued Sep 17, 2013

• Rotary magnetron magnet bar and apparatus containing the same for high target utilization

  • US US 20120261253 A1 · Filed Oct 26, 2010